Thank you for your interest in our available NSN parts 115721-0001 and components on Purchasing Union. 115721-0001 is described as a Microcircuit Memory part, and it is manufactured by Thales Usa Inc. This component is readily available for purchase today, and our team of industry experts are on standby 24/7x365 to provide you with rapid-lead times and competitive pricing on all that we carry. To begin the purchasing process, you may submit an Instant RFQ form as provided through our website. Once it is received, a member of our staff will reach out to you in 15 minutes or less to provide a personalized quote that is crafted to fit your individual needs.
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Purchasing Union is a state of the art purchasing platform, and we are a leading independent distributor of 115721-0001 that cater to a diverse set of industries and applications. To ensure the quality of our inventory for our customers, we choose to only source our parts from top global manufacturers that we trust, such as Thales Usa Inc. We also ensure that every part is rigorously tested, inspected, and cross-referenced before being shipped. Peruse our inventory at your leisure to find a multitude of top requested parts like 5962013333430, and our team is ready to serve as your strategic sourcing partner today. (CAGE Code 65597).
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-333-3430 Item Description: Microcircuit Memory | 5962 | 013333430 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
115721-0001 | 5 | 1 | C | A |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ADAT | BODY WIDTH0 500 INCHES MINIMUM AND 0 610 INCHES MAXIMUM |
MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | TEST | TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510 |
MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC60 00 MILLIAMPERES MAXIMUM SUPPLY |
MEMORY | ABKW | OVERALL HEIGHT0 357 INCHES MINIMUM AND 0 432 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT0 172 INCHES MINIMUM AND 0 217 INCHES MAXIMUM |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC5 0 VOLTS NOMINAL POWER SOURCE |
MEMORY | CZER | MEMORY DEVICE TYPEEPROM |
MEMORY | CZZZ | MEMORY CAPACITYUNKNOWN |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT |
MEMORY | ADAQ | BODY LENGTH1 490 INCHES MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING350 0 MILLIWATTS |
MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
MEMORY | CQZP | INPUT CIRCUIT PATTERN26 INPUT |
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC150 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 150 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
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